SMDOpen
SMD
Technical assessment and quote are provided before intervention.
Service
Microsoldering
Fine board-level work: SMD, BGA, ICs, FPC, traces, pads and NAND/UFS memory, after technical diagnosis.
BGAOpen
BGA
Technical assessment and quote are provided before intervention.
ICOpen
IC
Technical assessment and quote are provided before intervention.
FPCOpen
FPC
Technical assessment and quote are provided before intervention.
TRACEOpen
traces
Technical assessment and quote are provided before intervention.
PADOpen
pads
Technical assessment and quote are provided before intervention.
NANDOpen
NAND/UFS
Technical assessment and quote are provided before intervention.